ESM-RPL

COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module

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产品特点

COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module
2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB
1 x Intel® I226LM/IT
Intel® HD Audio Integrated on CPU
On board Storage NVMe SSD (Optional)
Onboard nuvoTon_NPCT754AADYX TPM 2.0
COMe Type 6 Basic Size: 4.92" x 3.74" (125*95 mm)
DC in +9V ~ +19V

规格

System Information

Processor

13th Gen. Intel® H-Series Embedded Industrial (45 W)
P-Series Embedded Industrial (28 W)

Processor

13th Gen. Intel® H-Series Embedded Industrial (45 W)
P-Series Embedded Industrial (28 W)
System Memory

2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB
I/O Chipset

EC iTE IT5782
Watchdog Timer

H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step
BIOS

AMI uEFI BIOS, 256 Mbit SPI Flash ROM
H/W Status Monitor

Monitoring System Temperature
Voltage and FAN Status with Auto Throttling Control
TPM

Onboard nuvoTon_NPCT754AADYX TPM 2.0 Optional

Expansion

Expansion

1 x PCIe x8 (Gen4), (Selected SKU, H series)
2 x PCIe x4 (Gen4)
Default: 5 x PCIe x1 (Gen3), 2 x SATA (2 Lanes Shares with SATA)

Expansion

1 x PCIe x8 (Gen4), (Selected SKU, H series)
2 x PCIe x4 (Gen4)
Default: 5 x PCIe x1 (Gen3), 2 x SATA (2 Lanes Shares with SATA)

Storage

Display

Graphic Chipset

Intel® Iris® Xe Graphics on i7/i5 Processor
Intel® UHD Graphics on i3/Celeron® Processor
Intel® Gfx Up to 96 EU

Graphic Chipset

Intel® Iris® Xe Graphics on i7/i5 Processor
Intel® UHD Graphics on i3/Celeron® Processor
Intel® Gfx Up to 96 EU
Spec. & Resolution

3 x DDI, VGA, eDP/LVDS (BOM Optional)
VGA Supported by Build Option Via DP-to-VGA IC, Max. Resolution 1920x1200@60Hz
LVDS Single/Dual Channel 18/24-bit LVDS from eDP-to-LVDS IC, Max. Resolution 1920x1200@60Hz in Dual Mode or
eDP Build Option in Place of LVDS, 4 lanes, eDP 1.4b (by BOM)
USB4 Max. 2 x USB4 in Place of DDI 1/2, Supports DP 1.4a by DP Alternative Mode
DDI3 for Avalue EX-EX26 Carrier HDMI 2.1 or DP 1.4a
Select by BIOS, Support Feature Depend on Carrier Board.
Multiple Display

Four Display Support, Up to 4K (3DDI+eDP)
LVDS

CH7511B(eDP to LVDS)
DDI

3 x DDI, VGA, eDP/LVDS (BOM Optional)
HDMI/DP(Default)
VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)

Audio

Ethernet

Software Support

Certification

I/O

Mechanical & Environmental

Operating Temp.

Standard 0°C ~ 60°C (32°F ~ 140°F)
Extend: -40°C ~ 70°C (-40°F ~ 158°F)

Operating Temp.

Standard 0°C ~ 60°C (32°F ~ 140°F)
Extend: -40°C ~ 70°C (-40°F ~ 158°F)
Storage Temp.

-40°C ~ 85°C (-40°F ~ 185°F)
Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing
Weight

0.44lbs (0.2Kg)
Power Requirement

+9V ~ +19V
Power Mode

AT/ATX
Dimension (L x W)

3.74" x 4.92" (125*95 mm)

Ordering Information

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