ESM-RPL
COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module
- COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module
- 2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB
- 1 x Intel® I226LM
- Intel® HD Audio Integrated on CPU
- On board Storage NVMe SSD (Optional)
- Onboard nuvoTon_NPCT754AADYX TPM 2.0 Optional
- COMe Type 6 Basic Size: 3.74" x 4.92" (125*95 mm)
- DC in +9V ~ +19V
Specification
System Information
-
Processor
13th Gen. Intel® H-Series Embedded Industrial (45 W)
P-Series Embedded Industrial (28 W)
U-Series Embedded / Industrial (15 W) -
System Memory
2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB
-
I/O Chipset
EC iTE IT5782
-
Watchdog Timer
H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step
-
BIOS
AMI uEFI BIOS, 256 Mbit SPI Flash ROM
-
H/W Status Monitor
Monitoring System Temperature
Voltage and FAN Status with Auto Throttling Control -
TPM
Onboard nuvoTon_NPCT754AADYX TPM 2.0 Optional
Expansion
-
Expansion
1 x PCIe x8 (Gen4), (Selected SKU, H series)
2 x PCIe x4 (Gen4)
Default: 5 x PCIe x1 (Gen3), 2 x SATA (2 Lanes Shares with SATA)
Storage
-
Storage
On board Storage NVMe SSD (Optional)
Display
-
Graphic Chipset
Intel® Iris® Xe Graphics on i7/i5 Processor
Intel® UHD Graphics on i3/Celeron® Processor
Intel® Gfx Up to 96 EU -
Spec. & Resolution
3 x DDI, VGA, eDP/LVDS (BOM Optional)
VGA Supported by Build Option Via DP-to-VGA IC, Max. Resolution 1920x1200@60Hz
VDS Single/Dual Channel 18/24-bit LVDS from eDP-to-LVDS IC, Max. Resolution 1920x1200@60Hz in Dual Mode or
eDP Build Option in Place of LVDS, 4 lanes, eDP 1.4b (by BOM)
USB4 Max. 2 x USB4 in Place of DDI 1/2, Supports DP 1.4a by DP Alternative Mode
DDI3 for Avalue EX-EX26 Carrier HDMI 2.1 or DP 1.4a
Select by BIOS, Support Feature Depend on Carrier Board. -
Multiple Display
Four Display Support, Up to 4K (3DDI+eDP)
-
LVDS
CH7511B(eDP to LVDS)
-
DDI
3 x DDI, VGA, eDP/LVDS (BOM Optional)
HDMI/DP(Default)
VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)
Audio
-
Audio Interface
Intel® HD Audio Integrated on CPU
Ethernet
-
LAN Chipset
1 x Intel® I226LM
-
Ethernet Interface
10/100/1000/2500 Base-Tx GbE Compatible
Software Support
-
OS
Windows 10 Enterprise 2021 LTSC
Ubuntu 22.04 (Kernel 5.15) above
Certification
-
Certification Information
CE, FCC Class, RoHS Compliant
I/O
-
USB
2 x USB 4 by TCP Ports (Optional by BIOS)
4 x USB3.2 Gen2
8 x USB2.0 -
COM Port
2 x UART (RX/TX Only)
-
SATA
2 x SATA III
-
DIO
1 x 8-bit GPIO
-
MIO
1 x SMBus
1 x LPC (Via ESPI-to-LPC Bridge IC)
1 x I2C (User)
1 x GP_SPI (TBC)
1x SPI
Mechanical & Environmental
-
Operating Temp.
Standard 0°C ~ 60°C (32°F ~ 140°F)
-
Storage Temp.
-40°C ~ 85°C (-40°F ~ 185°F)
-
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
-
Weight
0.44lbs (0.2Kg)
-
Power Requirement
+9V ~ +19V
-
Power Mode
AT/ATX
-
Dimension (L x W)
3.74" x 4.92" (125*95 mm)
Ordering Information
-
Ordering Information
ESM-RPL-S70-A1R
Intel® COM Express Module Type 6 on board Core™ I7-1370PE CPU, 28W
ESM-RPL-S40-A1R
Intel® COM Express Module Type 6 on board Core™ I5-1340PE CPU, 28W
ESM-RPL-S20-A1R
Intel® COM Express Module Type 6 on board Core™ I3-1320PE CPU, 28W
ESM-RPL-S80-A1R
Intel® COM Express Module Type 6 on board Core™ I7-13800HE CPU, 45W
ESM-RPL-S60-A1R
Intel® COM Express Module Type 6 on board Core™ I5-13600HE CPU, 45W
ESM-RPL-S30-A1R
Intel® COM Express Module Type 6 on board Core™ I3-13300HE CPU, 45W