ACP-Q6490
PRELIMINARY
- Qualcom QCS6490 high level platform up to 2.7GHz
- AI Engine up to 12TOPS
- Thin client concept and ruggedize, support a wide temperature range
- Various video interfaces and I/O connections: 2 USB3.2, HDMI, 4 COM, 40pin GPIO, 2 MIPI-CSI
- Strong Connectivity for WiFi, Ethernet, and BT
- Ideal for embedded applications in fields like automotive markets, retail and box pc with AI solution
Specification
System Information
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Processor
QCS6490
Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8) -
System Memory
8GB LPDDR4
Software Support
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OS
Win 11 IoT Enterprise LTSC, Android 13, Ubuntu 20.04 LTS , Qualcomm Linux
Expansion
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Expansion
Optional M.2 M Key for NVMe or M.2 E Key for WIFI/BT (available for non-Wifi model)
Storage
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UFS
128GB UFS
Display
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Multiple Display
HDMI or eDP 30pin (prmiary)
DP via Type-C(secondary)
Power Requirement
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DC Input
1 x DC-In (20V@5A) or 1 x PD-in USB Type C (20V@5A) (BOM option)
External I/O
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LAN Port
2 x 1Gb RJ45
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USB
1 X USB Type-C
2 X USB 3.2 Gen 1 (Type-A)
I/O
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UART
1 x Debug UART (Pin Header)
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GPIO
1 X 40 Pin ( QUP Configable (SPI / I2C / UART / I2S / I3C ), PWM / DMIC)
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RS232
4 x RS-232 (with RS-232 transceiver, via 2.0mm pitch WTB heater)
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USB
2 X USB 2.0 (WTB Type, 2.0mm pitch)
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Display
1 x eDP 30pins, 2 Lane
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Audio
1 X Speaker Amplifier WSA 8835
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WIFI
2 X Antenna IPEX Conn (Only available for Wi-Fi model)
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Camera
2 X MIPI-CSI
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RTC
Supported
Characteristics
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Board Structure
2.5" SBC
Mechanical & Environmental
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Operating Temp.
-20°C ~ 70°C
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Storage Temp.
-40°C ~ 80°C
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Dimension (L x W)
100mm x 72mm x 23.7mm
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Weight
150g