SMA-Q6490
Qualcomm QCS6490, Ultra low power, AI Computing with 12 TOPS (INT8)
- Compact, low-power Arm-based SOM for edge and embedded computing
- Built-in Qualcomm QCS6490 delivering up to 12 TOPS (INT8) AI computing power
- Cost-effective with WoA (Windows on Arm) and Android 13 support
- Wide interface support, including PCIe, USB, GbE, I²C, I²S, UART, CAN bus, MIPI-CSI, HDMI, DP/eDP
- Extended operating temperature from -25°C to 85°C for industrial grade
- Standardized connectivity for easy I/O customization
仕様
System Information
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Processor
Kryo 670 octa-core (1×2.7 GHz + 3×2.4 GHz + 4×1.9 GHz), Arm v8 Cortex architecture
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NPU
6th generation Qualcomm AI Engine, 12 TOPS with Hexagon DSP and tensor accelerator
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GPU
Adreno 643, up to ~812 MHz
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System Memory
8GB/16GB LPDDR5
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Watchdog Timer
Secure (TrustZone) HW watch dog: 22 seconds in default
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H/W Status Monitor
yes
Expansion
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Expansion
PCIe 3.0
Storage
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Storage
128GB UFS
Display
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Graphic Chipset
Adreno 643, up to ~812 MHz
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eDP
* 1
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Interface
PCIe3.0, GbE MDI, UART, USB, GPIO, DSI, I2C. I2S, DP, SDIO, CAN, MIPI-CSI, HDMI, eDP
Audio
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Audio Codec
N/A
Ethernet
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LAN Chipset
N/A
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Ethernet Interface
GbE MDI
Software Support
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OS
Win11 IoT (WoA), Android 13 (available in April)
Certification
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Certification Information
CE,FCC
I/O
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USB
2x USB3.2, 1x USB2.0
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I2C Bus
*3
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PCIe
PCIe 3.0 *2 , PCIe 3.0*1
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GPIO
*6
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HDMI
*1
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I2S
*2
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SPI
*1
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UART
*2
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CAN
*1
Mechanical & Environmental
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Operating Temp.
-25~60°C (commercial-grade), -25~85°C (Industrial grade , available in May)
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Storage Temp.
-25~75°C
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Operating Humidity
IEC60068-2-78, Damp Heat Steady State Test,40C,95%,48Hrs
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Weight
45 g
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Power Requirement
20W
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Dimension (L x W)
82 x 50 mm