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ESM-BYT2

Intel® Celeron®/Atom™ SoC Processor Type6 COMe Compact Module

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產品功能
  • Onboard Intel® Celeron®/Atom™ SoC BGA Processor
  • 1 x 204-Pin DDR3L 1066MHz SO-DIMM Up to 8 GB or 204-Pin DDR3L 1333MHz SO-DIMM Up to 8 GB Processor E3845 & J1900 Only Support 1333MHz
  • 1 x Intel® I210AT
  • Intel® HD Audio Integrated on CPU
  • COMe Type 6 Compact Size: 3.74” x 3.74” (95 x 95 mm)
  • Type 6 Rev. 2.1 Pin-out
  • DC in +9V ~ +19V

規格

System Information

  • Processor

    Intel® Celeron® J1900 4-Core 2.0GHz Processor
    Intel® Atom™ E3845 4-Core 1.91GHz Processor
    Intel® Atom™ E3825 2-Core 1.33GHz Processor

  • Processor

    Intel® Celeron® J1900 4-Core 2.0GHz Processor
    Intel® Atom™ E3845 4-Core 1.91GHz Processor
    Intel® Atom™ E3825 2-Core 1.33GHz Processor

  • System Memory

    1 x 204-Pin DDR3L 1066MHz SO-DIMM Up to 8 GB
    or 204-Pin DDR3L 1333MHz SO-DIMM Up to 8 GB
    Processor E3845 & J1900 Only Support 1333MHz

  • I/O Chipset

    EC iTE IT8528E

  • Watchdog Timer

    H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

  • BIOS

    AMI uEFI BIOS, 64Mbit SPI Flash ROM

  • H/W Status Monitor

    Monitoring System Temperature
    Voltage and FAN Status with Auto Throttling Control

Expansion

  • Expansion

    3 x PCIe x1

  • Expansion

    3 x PCIe x1

Display

  • Graphic Chipset

    Intel® SoC Integrated Graphics

  • Graphic Chipset

    Intel® SoC Integrated Graphics

  • Spec. & Resolution

    VGA: Max. Resolution 2560x1080@60Hz
    LVDS: Max. Resolution 1920x1080@60Hz
    DP: Max. Resolution 2560x1080@60Hz
    HDMI: Max. Resolution 1920 x 1080@60Hz

  • Multiple Display

    VGA + LVDS

  • LVDS

    CH7511B(eDP to LVDS)

  • DDI

    HDMI
    DVI
    DisplayPort

Audio

  • Audio Interface

    Intel® HD Audio Integrated on CPU

  • Audio Interface

    Intel® HD Audio Integrated on CPU

Ethernet

  • LAN Chipset

    1 x Intel® I210AT

  • LAN Chipset

    1 x Intel® I210AT

  • Ethernet Interface

    10/100/1000 Base-Tx Gigabit Ethernet Compatible

Software Support

  • OS

    Windows 8, Windows 7
    Linux
    Android

  • OS

    Windows 8, Windows 7
    Linux
    Android

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    1 x USB 3.0
    7 x USB 2.0

  • USB

    1 x USB 3.0
    7 x USB 2.0

  • COM Port

    1 x UART (RX/TX Only)

  • SATA

    2 x SATA II

  • DIO

    1 x 8-bit GPIO

  • MIO

    1 x SMBus
    1 x LPC
    1 x I2C

Mechanical & Environmental

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)
    Extended -40°C ~ 85°C (-40°F ~ 185°F)

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)
    Extended -40°C ~ 85°C (-40°F ~ 185°F)

  • Storage Temp.

    -40°C ~ 85°C (-40°F ~ 185°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.44lbs(0.2Kg)

  • Power Requirement

    +9V ~ +19V

  • Power Mode

    AT/ATX

  • Dimension (L x W)

    3.74” x 3.74” (95 x 95 mm)

Ordering Information

  • Ordering Information

    ESM-BYT2-E3845-A3R
    Intel® Atom™ SoC Processor E3845D1 Type6 COMe Compact Module

    ESM-BYT2-E3825-A3R
    Intel® Atom™ SoC Processor E3825D1 Type6 COMe Compact Module

    EEV-EX14-B1R
    mATX Ev. Board for COMe Type 6 A2

    ESM-BYT2-HSK-A1R
    Heatsink for ESM-BYT2 W/O FAN H=36mm

    ESM-BYT2-HSP-A1R
    Heatspreader for ESM-BYT2
     

  • Ordering Information

    ESM-BYT2-E3845-A3R
    Intel® Atom™ SoC Processor E3845D1 Type6 COMe Compact Module

    ESM-BYT2-E3825-A3R
    Intel® Atom™ SoC Processor E3825D1 Type6 COMe Compact Module

    EEV-EX14-B1R
    mATX Ev. Board for COMe Type 6 A2

    ESM-BYT2-HSK-A1R
    Heatsink for ESM-BYT2 W/O FAN H=36mm

    ESM-BYT2-HSP-A1R
    Heatspreader for ESM-BYT2