安勤科技

Processor

EATX form factor (12” x 13”, 305 x 330mm), PICMG®COM-HPC® Revision 1.2, COM-HPC client pin-out, size A(95x120mm), B(120x120mm), and C(160x120mm) compatible

Expansion

1 x PCIex16 Gen5 slot
8 x PCIex4 slot
1 x PCIex1 slot for BMC

Multiple Display

Depends on the COM-HPC module

DDI

3 x DDI configurable to DP2.1 or HDMI 2.1b by 2x IET module
1 x eDP

Audio Codec

Realtek ALC888S HD Audio Decoding Controller

Audio Interface

Line-out, Mic-in

Ethernet Interface

2 x 10 or 25 Gigabit Ethernet connector by 1x IET module
2 x 2.5 Gigabit Ethernet connector by 2x IET module

OS

According to COM-HPC Module Solution

Certification Information

CE, FCC, RoHS Compliant

USB

4 x USB3.2 Gen2x2 (Type C) by 2x IET module
4 x USB2.0 by pin header

GPIO

12-bit GPIO

UART

2 x Serial Port

Operating Temp.

0°C ~ 60°C (32°F ~ 140°F) with 0.5m/s air flow

Storage Temp.

-20°C ~ 75°C (-4°F ~ 167°F)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Power Mode

AT/ATX mode Switchable Through SW1

Dimension (L x W)

12” x 13” (305 x 330mm)

Ordering Information

EEV-HC10-A1R