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ACP-Q6490

PRELIMINARY

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Comparison

資料表

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Comparison

資料表

  • Qualcom QCS6490 high level platform up to 2.7GHz
  • AI Engine up to 12TOPS
  • Thin client concept and ruggedize, support a wide temperature range
  • Various video interfaces and I/O connections: 2 USB3.2, HDMI, 4 COM, 40pin GPIO, 2 MIPI-CSI
  • Strong Connectivity for WiFi, Ethernet, and BT
  • Ideal for embedded applications in fields like automotive markets, retail and box pc with AI solution
  • 規格
  • 常見問題

產品規格

System Information

  • Processor

    QCS6490
    Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8)

  • System Memory

    8GB LPDDR4

Software Support

  • OS

    Win 11 IoT Enterprise LTSC, Android 13, Ubuntu 20.04 LTS , Qualcomm Linux

Expansion

  • Expansion

    Optional M.2 M Key for NVMe or M.2 E Key for WIFI/BT (available for non-Wifi model)

Storage

  • UFS

    128GB UFS

Display

  • Multiple Display

    HDMI or eDP 30pin (prmiary)
    DP via Type-C(secondary)

Power Requirement

  • DC Input

    1 x DC-In (20V@5A) or 1 x PD-in USB Type C (20V@5A) (BOM option)

External I/O

  • LAN Port

    2 x 1Gb RJ45

  • USB

    1 X USB Type-C
    2 X USB 3.2 Gen 1 (Type-A)

I/O

  • UART

    1 x Debug UART (Pin Header)

  • GPIO

    1 X 40 Pin ( QUP Configable (SPI / I2C / UART / I2S / I3C ), PWM / DMIC)

  • RS232

    4 x RS-232 (with RS-232 transceiver, via 2.0mm pitch WTB heater)

  • USB

    2 X USB 2.0 (WTB Type, 2.0mm pitch)

  • Display

    1 x eDP 30pins, 2 Lane

  • Audio

    1 X Speaker Amplifier WSA 8835

  • WIFI

    2 X Antenna IPEX Conn (Only available for Wi-Fi model)

  • Camera

    2 X MIPI-CSI

  • RTC

    Supported

Characteristics

  • Board Structure

    2.5" SBC

Mechanical & Environmental

  • Operating Temp.

    -20°C ~ 70°C

  • Storage Temp.

    -40°C ~ 80°C

  • Dimension (L x W)

    100mm x 72mm x 23.7mm

  • Weight

    150g

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