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ESM-RPL

COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module

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Comparison

数据表

Get a Quote

Comparison

数据表

  • COM Express Rev. 3.1 Intel®13th Generation Core™ Embedded Mobile Processor Type6 COMe Basic Module
  • 2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB
  • 1 x Intel® I226LM
  • Intel® HD Audio Integrated on CPU
  • On board Storage NVMe SSD (Optional)
  • Onboard nuvoTon_NPCT754AADYX TPM 2.0 Optional
  • COMe Type 6 Basic Size: 3.74" x 4.92" (125*95 mm)
  • DC in +9V ~ +19V
  • 规格
  • 文档
  • 常见问题

产品规格

System Information

  • Processor

    13th Gen. Intel® H-Series Embedded Industrial (45 W)
    P-Series Embedded Industrial (28 W)
    U-Series Embedded / Industrial (15 W)

  • System Memory

    2 x 262-Pin DDR5 4800MT/s SO-DIMM Up to 64GB

  • I/O Chipset

    EC iTE IT5782

  • Watchdog Timer

    H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

  • BIOS

    AMI uEFI BIOS, 256 Mbit SPI Flash ROM

  • H/W Status Monitor

    Monitoring System Temperature
    Voltage and FAN Status with Auto Throttling Control

  • TPM

    Onboard nuvoTon_NPCT754AADYX TPM 2.0 Optional

Expansion

  • Expansion

    1 x PCIe x8 (Gen4), (Selected SKU, H series)
    2 x PCIe x4 (Gen4)
    Default: 5 x PCIe x1 (Gen3), 2 x SATA (2 Lanes Shares with SATA)

Storage

  • Storage

    On board Storage NVMe SSD (Optional)

Display

  • Graphic Chipset

    Intel® Iris® Xe Graphics on i7/i5 Processor
    Intel® UHD Graphics on i3/Celeron® Processor
    Intel® Gfx Up to 96 EU

  • Spec. & Resolution

    3 x DDI, VGA, eDP/LVDS (BOM Optional)
    VGA Supported by Build Option Via DP-to-VGA IC, Max. Resolution 1920x1200@60Hz
    VDS Single/Dual Channel 18/24-bit LVDS from eDP-to-LVDS IC, Max. Resolution 1920x1200@60Hz in Dual Mode or
    eDP Build Option in Place of LVDS, 4 lanes, eDP 1.4b (by BOM)
    USB4 Max. 2 x USB4 in Place of DDI 1/2, Supports DP 1.4a by DP Alternative Mode
    DDI3 for Avalue EX-EX26 Carrier HDMI 2.1 or DP 1.4a
    Select by BIOS, Support Feature Depend on Carrier Board.

  • Multiple Display

    Four Display Support, Up to 4K (3DDI+eDP)

  • LVDS

    CH7511B(eDP to LVDS)

  • DDI

    3 x DDI, VGA, eDP/LVDS (BOM Optional)
    HDMI/DP(Default)
    VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)

Audio

  • Audio Interface

    Intel® HD Audio Integrated on CPU

Ethernet

  • LAN Chipset

    1 x Intel® I226LM

  • Ethernet Interface

    10/100/1000/2500 Base-Tx GbE Compatible

Software Support

  • OS

    Windows 10 Enterprise 2021 LTSC
    Ubuntu 22.04 (Kernel 5.15) above

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    2 x USB 4 by TCP Ports (Optional by BIOS)
    4 x USB3.2 Gen2
    8 x USB2.0

  • COM Port

    2 x UART (RX/TX Only)

  • SATA

    2 x SATA III

  • DIO

    1 x 8-bit GPIO

  • MIO

    1 x SMBus
    1 x LPC (Via ESPI-to-LPC Bridge IC)
    1 x I2C (User)
    1 x GP_SPI (TBC)
    1x SPI

Mechanical & Environmental

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)

  • Storage Temp.

    -40°C ~ 85°C (-40°F ~ 185°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.44lbs (0.2Kg)

  • Power Requirement

    +9V ~ +19V

  • Power Mode

    AT/ATX

  • Dimension (L x W)

    3.74" x 4.92" (125*95 mm)

Ordering Information

  • Ordering Information

    ESM-RPL-S70-A1R
    Intel® COM Express Module Type 6 on board Core™ I7-1370PE CPU, 28W

    ESM-RPL-S40-A1R
    Intel® COM Express Module Type 6 on board Core™ I5-1340PE CPU, 28W

    ESM-RPL-S20-A1R
    Intel® COM Express Module Type 6 on board Core™ I3-1320PE CPU, 28W

    ESM-RPL-S80-A1R
    Intel® COM Express Module Type 6 on board Core™ I7-13800HE CPU, 45W

    ESM-RPL-S60-A1R
    Intel® COM Express Module Type 6 on board Core™ I5-13600HE CPU, 45W

    ESM-RPL-S30-A1R
    Intel® COM Express Module Type 6 on board Core™ I3-13300HE CPU, 45W

  • BIOS
    1
  • Chipset
    1
  • Audio
    1
  • Graphics
    1
  • LAN
    1
  • Design Document
    3
  • Manual
    1
  • Other Driver
    1
  • ME
    1
  • 全部内容
  • Windows 11 64bit
  • BIOS

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-04-30
    ESM-RPL
    (SRP2006)ESM-RPL/ESM-RPLC 1.00 CS:B65AH,P/N:E1512290600R
    • 不适用

    Chipset

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Intel Chipset Driver_10.1.19444.8378
    Intel Chipset Driver_10.1.19444.8378
    • Windows 11 64bit

    Audio

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Realtek Audio Driver
    Realtek Audio Driver_9643.1_UAD_WHQL_2024_0217_132943_SVID_1AC2
    • Windows 11 64bit

    Graphics

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Intel Graphics_31.0.101.4887
    Intel Graphics_31.0.101.4887
    • Windows 11 64bit

    LAN

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Intel Ethernet Driver_28.2.1_x64
    Intel Ethernet Driver_28.2.1_x64
    • Windows 11 64bit

    Design Document

    总计 3 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-04-24
    3D_Board_ESM-RPL.zip
    • 不适用
    2024-04-24
    3D_Cooler_ESM-RPL.zip
    • 不适用
    2024-04-24
    3D_Heat-spreader_ESM-RPL.zip
    • 不适用

    Manual

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-04-29
    ESM-RPL 1st Manual
    • 不适用

    Other Driver

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Intel_SerialIO_30.100.2237.26_v3
    Intel_SerialIO_30.100.2237.26_v3_RPL_ADL-PCH_22H2
    • Windows 11 64bit

    ME

    总计 1 档案

    编号
    发布日期
    标题、描述
    操作系统
    文档
    下载
    2024-05-09
    Intel_CSME_SW_2249.3.39.0_Corporate
    Intel_CSME_SW_2249.3.39.0_Corporate
    • Windows 11 64bit

    已加入并进行比较。

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