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ACP-Q6490

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Qualcom QCS6490 high level platform up to 2.7GHz
AI Engine up to 12TOPS
Thin client concept and ruggedize, support a wide temperature range
Various video interfaces and I/O connections: 2 USB3.2, HDMI, 4 COM, 40pin GPIO, 2 MIPI-CSI
Strong Connectivity for WiFi, Ethernet, and BT
Ideal for embedded applications in fields like automotive markets, retail and box pc with AI solution

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System Information

Processor

QCS6490
Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8)
System Memory

8GB LPDDR4

Software Support

OS

Win 11 IoT Enterprise LTSC, Android 13, Ubuntu 20.04 LTS , Qualcomm Linux

Expansion

Expansion

Optional M.2 M Key for NVMe or M.2 E Key for WIFI/BT (available for non-Wifi model)

Storage

UFS

128GB UFS

Display

Multiple Display

HDMI or eDP 30pin (prmiary)
DP via Type-C(secondary)

Power Requirement

DC Input

1 x DC-In (20V@5A) or 1 x PD-in USB Type C (20V@5A) (BOM option)

External I/O

LAN Port

2 x 1Gb RJ45
USB

1 X USB Type-C
2 X USB 3.2 Gen 1 (Type-A)

I/O

UART

1 x Debug UART (Pin Header)
GPIO

1 X 40 Pin ( QUP Configable (SPI / I2C / UART / I2S / I3C ), PWM / DMIC)
RS232

4 x RS-232 (with RS-232 transceiver, via 2.0mm pitch WTB heater)
USB

2 X USB 2.0 (WTB Type, 2.0mm pitch)
Display

1 x eDP 30pins, 2 Lane
Audio

1 X Speaker Amplifier WSA 8835
WIFI

2 X Antenna IPEX Conn (Only available for Wi-Fi model)
Camera

2 X MIPI-CSI
RTC

Supported

Characteristics

Board Structure

2.5" SBC

Mechanical & Environmental

Operating Temp.

-20°C ~ 70°C
Storage Temp.

-40°C ~ 80°C
Dimension (L x W)

100mm x 72mm x 23.7mm
Weight

150g

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