Avalue Technology News Center

HPC — or high performance computing — has been an area of significant development in recent years, as businesses seek to outpace their competitors with ever more powerful systems and software solutions.

Now, with Q1 of 2025 already complete, where are we currently at? What are the high computing performance system trends we can expect for the rest of this year and for the years to follow?

Read on to discover more about this.

One of the things about high performance computing systems is that they typically perform close to the cutting edge of existing technology. This means they tend to be expensive and inaccessible for smaller businesses and organizations.

This hasn't necessarily been a problem. Smaller enterprises have been fairly content, knowing that both they and their competitors are using the best components available — even if these components don't necessarily hit the HPC threshold.

However, this is changing. Components such as the ARM-based RSC-IMX61 SBC and the EPI-ARLS EPIC embedded motherboard are now very much within the grasp of businesses of all sizes. This means it is accessible to competitors too, and so organizations must work to adopt high performance computing systems to avoid falling behind.

Two of the biggest areas of development in high performance computing, both in 2025 and beyond, will be AI and edge computing. AI, or artificial intelligence, requires vast amounts of data and processing power, as large language models (LLMs) are trained upon vast and diverse datasets. In order to leverage the very best from AI — and organizations must do this in the modern market — high computing performance is going to be key.

While edge computing is different from AI computing, it is inextricably linked. With an edge system, organization bosses and facility managers can gather data at or close to the source. Data is then processed at "the edge" of the network, so AI and other data-intensive concepts can be executed with minimal latency.

The rise of edge computing is leading to increased miniaturization in component development. As edge devices are usually much smaller than centralized server units, there is a strong need for smaller components. However, these components cannot compromise on computing power and capability. The 1.8-inch EZX-EHLP SBC and the 2.5-inch EPX-APLP Pico ITX are examples of how even smaller components can still provide formidable processing power.

Regulatory compliance is constantly changing, and this is influencing the ways in which high performance computing components are developed. These components require significant amounts of finite natural resources, and so work is underway to find replacement materials that make components more environmentally sustainable.

Creating renewable, human-made materials or recycling existing materials may be the answer here. As environmental and social sustainability rules become increasingly strict, this is going to be a key area of exploration for development teams.

The components themselves need to be sustainable too. It's not just developers who need to stay compliant with regulations — the businesses that deploy these components also need to act within relevant guidelines. This is why components like the MX610HD Mini ITX and the EMX-SKLUP embedded motherboard — both designed with low power usage in mind — are going to be so valuable to businesses in 2025 and beyond.

Recent global events have led to geopolitical shifts on a global scale. New policies from President Donald Trump are intended to increase American dominance, both in terms of the development of digital software and in the manufacture of HPC hardware. The idea is to reduce America's reliance on international imports, but some worry this could destabilize global trade networks over the next few years.

Business developments have also hinted that we are heading for a more multipolar future. The emergence of the Chinese AI solution Deep Seek has challenged the dominance of ChatGPT and has, in turn, ushered in a more competitive landscape.

The exact repercussions of this remain unclear, but we can expect a few significant developments. One is that new manufacturing markets will emerge as nations seek to gain their own slice of the global high performance computing industry. Another is that there will be increased competition in the software market, accelerating development and causing an increasing headache for regulators who are already struggling to keep pace.

Additive manufacturing (AM) and 3D printing have been around for a while, but they are really hitting their stride as far as high-performance computing is concerned. Once, AM was only really used for developing circuit boards and composite housing for components. These days, advances in 3D printing mean that connective components, such as circuitry and processors, can be additively manufactured too.

This means components can be prototyped and tested far more cheaply. On top of this, the finished article can be additively manufactured as well, accelerating numerous aspects of development while reducing the strain on the global supply chain.

These developments may also make it easier to keep devices in the field and operating at maximum capacity for longer. Organizations can print a replacement component within minutes, rather than waiting days or even weeks to receive a replacement part. This leads to less downtime and more operational agility.

Avalue has an excellent track record in delivering the very best high-performance computing components to businesses around the world. This is because we offer one of the leading ranges of these components, giving businesses the parts they need to build highly competitive systems.

Explore our range today and find what you need, or reach out to our team directly with any questions or queries.