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COMING SOON

ESM-ASLC

Intel Atom® x7000RE Series Processors Type6 COMe Compact Module

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Comparison

Datasheet

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Comparison

Datasheet

  • Feature
  • Specification

ProductFeatures

  • PICMG COM R3.1 Type 6 module with Intel Atom® x7000RE Processors
  • 1 x 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 16GB Max, support In-Band ECC memory protection (selected SKUs)
  • 1 x Intel® i226-IT
  • Intel® HD Audio Integrated in SOC
  • Onboard TPM 2.0 Optional
  • COMe Type 6 Basic Size: 3.74" x 3.74” (95 x 95 mm)
  • DC in +9V ~ +19V

ProductSpecification

System Information

  • Processor

    Intel Atom® x7000RE Series Processors

  • System Memory

    1 x 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 16GB Max,
    support In-Band ECC memory protection (selected SKUs)

  • I/O Chipset

    EC iTE IT5782VG-I-128/BX or Super IO Equivalent

  • Watchdog Timer

    H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

  • BIOS

    AMI uEFI BIOS, 256 Mbit SPI Flash ROM

  • H/W Status Monitor

    Monitoring System Temperature
    Voltage and FAN Status with Auto Throttling Control

  • TPM

    Onboard TPM 2.0 Optional

Expansion

  • Expansion

    4 x PCIe x1 (Gen3) or 1 x PCIe x4 (Gen3) or 2 x PCIe x1 (Gen3)

Storage

  • Storage

    eMMC 5.1 Up to 128GB (Optional)

Display

  • Graphic Chipset

    Intel® UHD Graphics

  • Spec. & Resolution

    1 x HDMI 2.0b: 4096x2160 @60Hz
    1 x DP 1.4a: 4096x2160 @60Hz
    1 x LVDS (via eDP-to-LVDS): 1920x1080 @60Hz, LVDS via CH7511B or 1 x eDP 1.4b(By BOM Optional): 4096x2160 @60Hz

  • Multiple Display

    Triple Display Support

  • LVDS

    CH7511B(eDP to LVDS)

  • DDI

    3 x DDI
    DDI1: 2 CH LVDS (via eDP-to-LVDS) or eDP(By BOM Optional)
    DDI2: DDI Signal
    TCP0: DDI2 signal or Type C signal

Audio

  • Audio Interface

    Intel® HD Audio Integrated on CPU

Ethernet

  • LAN Chipset

    1 x Intel® i226-IT

  • Ethernet Interface

    10/100/1000/2500 Base-Tx GbE Compatible

Software Support

  • OS

    Windows 11 64-bit, Linux

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    8 x USB2.0, 2 x USB3.2 Gen 2x1 or
    8 x USB2.0, 4 x USB3.2 Gen 2x1 or
    8 x USB2.0, 4 x USB3.2 Gen 2x1

  • COM Port

    2 x UART (RX/TX Only)

  • SATA

    2 x SATA III or N/A

  • DIO

    1 x 8-bit GPIO

  • MIO

    1 x SMBus
    1 x LPC
    1 x eSPI (W-B 10Px1 1.0mm 90D for debug conn)
    1 x I2C
    1 x SPI

Mechanical & Environmental

  • Operating Temp.

    Extended -40°C ~ 85°C (-40°F ~ 185°F)

  • Storage Temp.

    -40°C ~ 75°C (-40°F ~ 167°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.44lbs (0.2Kg)

  • Power Requirement

    +9V ~ +19V

  • Power Mode

    AT/ATX

  • Dimension (L x W)

    3.74” x 3.74” (95 x 95 mm)

Ordering Information

  • Ordering Information

    TBC

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