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AVAILABLE

ECM-TGUC

11th Gen Intel® Core™ SoC i5/i3 BGA Processor 3.5” Micro Module

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Comparison

Datasheet

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Comparison

Datasheet

  • Feature
  • Specification
  • Document

ProductFeatures

  • Bottom Layer Soldered Processor
  • Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (Non-ECC Supported)
  • Triple display, 2 x DP++, 1 x 2CH LVDS/1x eDP (Default LVDS)
  • Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
  • Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
  • DC in +12V ~ +24V

ProductSpecification

System Information

  • Processor

    11th Gen. Intel® Core™ SoC i5/i3 BGA Processor
    Intel® Core™ i3-1115G4 (up to 4.1GHz, dual-core, 6M Cache, TDP: 28/15W)
    Intel® Core™ i5-1135G7 (up to 4.2GHz, quad-core, 8M Cache, TDP: 28/15W)

  • System Memory

    1 x 260-pin DDR4 3200MHz SO-DIMM Socket, Supports Up to 32GB Max. (non ECC only)

  • I/O Chipset

    nuvoTon NCT6126D

  • Watchdog Timer

    H/W Reset, 5~255 Seconds/5~255 Minutes

  • BIOS

    AMI BIOS, 256Mbit SPI Flash ROM

  • H/W Status Monitor

    CPU & System Temperature Monitoring Voltages Monitoring

  • TPM

    Onboard nuvoTon NPCT750AADYX Support TPM 2.0, Co-lay infineon SLB9670VQ2.0 & 國民技術 Z32H330TC-SQN-755

  • Board

    3.5"

Expansion

  • Expansion

    1 x M.2 Type M 2280 (with 1 x PCI-e Gen4 x4)
    1 x M.2 Type B 3042/3052/2242 (with SATA and USB 2.0, USB 3.0, with 1 x SIM card slot, supports WWAN+GNSS or SSD)
    * Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) 3.8V for 5G
    1 x M.2 Type E 2230 supports WiFi module (1 x PCI-e x1 & USB 2.0 Signal))

Storage

  • Storage

    1 x M.2 (Type B, 3052)
    1 x M.2 (Type M, 2280)
    1 x SATA III

Display

  • Graphic Chipset

    Intel® 12th Generation CPU Integrated

  • Spec. & Resolution

    DP++ Max resolution 4096x2160@60Hz
    LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits or 1x eDP 1920 x 1080@60Hz (2 Lanes), default LVDS

  • Multiple Display

    Triple Display

  • LVDS

    1 x LVDS: 1920 x 1080 Dual Channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)

Audio

  • Audio Codec

    Realtek ALC888S HD Audio Decoding Controller

  • Audio Interface

    Line-in, Mic-in, Line-out

Ethernet

  • LAN Chipset

    1 x Intel® I219LM Gigabit Ethernet
    1 x Intel® I225V Gigabit Ethernet

  • Ethernet Interface

    1 x 10/100/1000/2.5G Base-Tx GbE compatible
    1 x 10/100/1000 Base-Tx GbE compatible

  • LAN Port

    2 x RJ-45

Power Requirement

  • Power Mode

    AT/ATX (Default Setting: AT)

Software Support

  • OS

    Windows 10, Linux

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    3 x USB 3.2 Gen2x1
    5 x USB 2.0

  • COM Port

    5 x RS232
    1 x RS-232/422/485

  • SATA

    1 x SATA III

  • DIO

    1 x 8-bit GPIO

  • MIO

    1 x SPI
    1 x SIM Card Slot

Mechanical & Environmental

  • Operating Temp.

    Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s Air Flow

  • Storage Temp.

    -40°C ~ 75°C (-40°F ~ 167°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.44lbs (0.2kg)

  • Power Requirement

    DC in +12V ~ +24V

  • Dimension (L x W)

    5.7" x 4" (146mm x 101mm)

Ordering Information

  • Ordering Information

    ECM-TGUC-15-A1R, ECM-TGUC/i31115G4/1SATA/6COM/8USB/15W/A1
    ECM-TGUC-35-A1R, ECM-TGUC/i51135G7/1SATA/6COM/8USB/15W/A1

RelatedDocument

  • BIOS (1)
  • Chipset (1)
  • Audio (2)
  • Graphics (1)
  • LAN (1)
  • Design Document (4)
  • Manual (1)
  • Other Driver (2)
No.
Release Date
Title
Description
Document
Download
2023-11-01
CTGC150I)ECM-TGUC Consumer 1.20 CS:181DH,P/N:C1512395603R
No.
Release Date
Title
Description
Document
Download
2023-11-01
Intel_Tiger Lake_Chipset_Win10_64_10.1.18698.8258
No.
Release Date
Title
Description
Document
Download
2023-11-01
Realtek Audio control Win10_64_1.36.273.0
2023-11-01
Realtek_ALC888S_Audio_Win10_64_6.0.9310.1
No.
Release Date
Title
Description
Document
Download
2023-11-01
Intel_Tiger Lake_Video_Win10_64_100.9665
No.
Release Date
Title
Description
Document
Download
2023-11-01
Intel_I219_I255_Lan_Win10_64_26.8
No.
Release Date
Title
Description
Document
Download
2023-11-01
ECM-TGUC_Board with Heatsink Assembled
2023-11-01
ECM-TGUC-Sink Assemble Guide
2023-11-01
3D_Board_ECM-TGUC
2023-11-01
3D_Heatsink_ECM-TGUC_15W
No.
Release Date
Title
Description
Document
Download
2023-11-01
ECM-TGUC 1st Manual
No.
Release Date
Title
Description
Document
Download
2023-11-01
Intel Serial IO_Win10_30.100.2104.1
2023-11-01
Intel ME Win10_64_15.0.30.1776

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